Influence of packaging processes and temperature on characteristics of Schottky diodes made of SiC
Gorecki, Pawel; Mysliwiec, Marcin; Gorecki, Krzysztof; Kisiel, Ryszard
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Gorecki, Pawel; Mysliwiec, Marcin; Gorecki, Krzysztof; Kisiel, Ryszard
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小5.56KB
- 发表时间2019
- DOI10.1109/TCPMT.2019.2894970
- 页码1-1