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Influence of packaging processes and temperature on characteristics of Schottky diodes made of SiC

Influence of packaging processes and temperature on characteristics of Schottky diodes made of SiC

Gorecki, Pawel; Mysliwiec, Marcin; Gorecki, Krzysztof; Kisiel, Ryszard
  • 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
  • 作者Gorecki, Pawel; Mysliwiec, Marcin; Gorecki, Krzysztof; Kisiel, Ryszard
  • 印刷ISSN2156-3950
  • 电子ISSN2156-3985
  • 文件大小5.56KB
  • 发表时间2019
  • DOI10.1109/TCPMT.2019.2894970
  • 页码1-1
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