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Relationship between the thermal stress and structures of thermal-cycling-induced cracks in electroless nickel plating on metalized substrates

Relationship between the thermal stress and structures of thermal-cycling-induced cracks in electroless nickel plating on metalized substrates

Fukuda, Shinji; Shimada, Kazuhiko; Izu, Noriya; Miyazaki, Hiroyuki; Iwakiri, Shoji; Hirao, Kiyoshi
  • 期刊名称Journal of Materials Science: Materials in Electronics
  • 作者Fukuda, Shinji; Shimada, Kazuhiko; Izu, Noriya; Miyazaki, Hiroyuki; Iwakiri, Shoji; Hirao, Kiyoshi
  • 印刷ISSN0957-4522
  • 电子ISSN1573-482X
  • 文件大小14152.88KB
  • 发表时间2019-2-19
  • DOI10.1007/s10854-019-00880-6
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