Effect of Thermal Cycling on Interfacial Microstructure and Mechanical Properties of Sn-0.3Ag-0.7Cu-(α-Al2O3) Nanoparticles/Cu Low-Ag Solder Joints

• 期刊名称Journal of Electronic Materials
• 作者Wu, Jie; Xue, Songbai; Wang, Jingwen; Xue, Peng
• 印刷ISSN0361-5235
• 电子ISSN1543-186X
• 文件大小2670.78KB
• 发表时间2019-5-2
• DOI10.1007/s11664-019-07211-9