Hot Chips 30
- 期刊名称IEEE Micro
- 作者Kubiatowicz, John; Rusu, Stefan
- 卷第39卷
- 期第2期
- 印刷ISSN0272-1732
- 电子ISSN1937-4143
- 文件大小113.37KB
- 发表时间2019-3-1
- DOI10.1109/MM.2019.2899510
- 页码6-8
Metal Foams: Fundamentals and ApplicationsReay, David · Applied Thermal Engineering · 2013
Adsorption heat powered heat pumpsMeunier, Francis · Applied Thermal Engineering · 2013
Waste heat usageSwithenbank, Jim; Finney, Karen N.; Chen, Qun; Yang, Yao Bin; Nolan, Andy; Sharifi, Vida N. · Applied Thermal Engineering · 2013
Letter to the EditorSayin, Cenk; Gumus, Metin; Canakci, Mustafa · Applied Thermal Engineering · 2014
Review of alternative cooling technologiesSteven Brown, J.; Domanski, Piotr A. · Applied Thermal Engineering · 2014
Performance evaluation of ventilation radiatorsMyhren, Jonn Are; Holmberg, Sture · Applied Thermal Engineering · 2013
Publisher NoteApplied Thermal Engineering · 2013
Measuring fire size in tunnelsGuo, Xiaoping; Zhang, Qihui · Applied Thermal Engineering · 2013