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[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Self-Healing Metal Interconnect for Flexible Electronic Device

[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Self-Healing Metal Interconnect for Flexible Electronic Device

Koshi, Tomoya; Iwase, Eiji

作者Koshi, Tomoya; Iwase, Eiji
文件大小1243.65KB
发表时间2019
DOI10.23919/ICEP.2019.8733474
页码291-293

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