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[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - MEMS calorimetric shear-stress sensor based on flexible substrate

[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - MEMS calorimetric shear-stress sensor based on flexible substrate

Chamard, Leo; Giani, Alain; Combette, Philippe; Weiss, Julien

作者Chamard, Leo; Giani, Alain; Combette, Philippe; Weiss, Julien
文件大小1135.58KB
发表时间2019
DOI10.1109/DTIP.2019.8752856
页码1-4

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