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[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Investigations of Aluminum Nitride based piezoelectric MEMS

[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Investigations of Aluminum Nitride based piezoelectric MEMS

Stiebing, Martin; Tavakolibasti, Majid; Stoeckel, Chris; Hiller, Karla; Wunderle, Bernhard
  • 作者Stiebing, Martin; Tavakolibasti, Majid; Stoeckel, Chris; Hiller, Karla; Wunderle, Bernhard
  • 文件大小2321.33KB
  • 发表时间2019
  • DOI10.1109/DTIP.2019.8752638
  • 页码1-5
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