[IEEE 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) - Glasgow, United Kingdom (2019.7.8-2019.7.10)] 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) - Flexible Multi-Modal Sensor for Electronic Skin
Jung, Minhyun; Vishwanath, Sujaya Kumar; Kim, Jihoon; Ko, Dae-Kwan; Park, Myung-Jin; Lim, Soo-Chul; Jeon, Sanghun
- 作者Jung, Minhyun; Vishwanath, Sujaya Kumar; Kim, Jihoon; Ko, Dae-Kwan; Park, Myung-Jin; Lim, Soo-Chul; Jeon, Sanghun
- 文件大小1095.29KB
- 发表时间2019
- DOI10.1109/FLEPS.2019.8792246
- 页码1-3