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[IEEE 2019 IEEE International Symposium on Circuits and Systems (ISCAS) - Sapporo, Japan (2019.5.26-2019.5.29)] 2019 IEEE International Symposium on Circuits and Systems (ISCAS) - A Two-Stage Push-Pull Power Amplifier with Electro-Thermal Effects Study in 130 nm SOI CMOS for IEEE 802.11ac Applications

[IEEE 2019 IEEE International Symposium on Circuits and Systems (ISCAS) - Sapporo, Japan (2019.5.26-2019.5.29)] 2019 IEEE International Symposium on Circuits and Systems (ISCAS) - A Two-Stage Push-Pull Power Amplifier with Electro-Thermal Effects Study in 130 nm SOI CMOS for IEEE 802.11ac Applications

Guo, Ting; Chen, Bo; Tang, Kai; Lou, Liheng; Fang, Zhongyuan; Yu, Bo; Zhang, Shaoqiang; Zheng, Yuanjin
  • 作者Guo, Ting; Chen, Bo; Tang, Kai; Lou, Liheng; Fang, Zhongyuan; Yu, Bo; Zhang, Shaoqiang; Zheng, Yuanjin
  • 文件大小562.99KB
  • 发表时间2019
  • DOI10.1109/ISCAS.2019.8702166
  • 页码1-4
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