[IEEE 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) - Chambéry, France (2019.6.18-2019.6.21)] 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) - Study of the coupling of wide band Near Field Scan probe dedicated to the investigation of the radiated immunity of Printed Circuit Boards

• 作者DURIER, Andre; BEN DHIA, Sonia; DUBOIS, Tristan
• 文件大小1875.98KB
• 发表时间2019
• DOI10.1109/sapiw.2019.8781661
• 页码1-4