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Elastic Behavior of Coarse-Grained SnAgCu (SAC) Solder Joints Based on an Anisotropic Multi-scale Predictive Modeling Approach

Elastic Behavior of Coarse-Grained SnAgCu (SAC) Solder Joints Based on an Anisotropic Multi-scale Predictive Modeling Approach

Jiang, Qian; Deshpande, Abhishek; Dasgupta, Abhijit
  • 期刊名称Journal of Electronic Materials
  • 作者Jiang, Qian; Deshpande, Abhishek; Dasgupta, Abhijit
  • 印刷ISSN0361-5235
  • 电子ISSN1543-186X
  • 文件大小2290.17KB
  • 发表时间2019-9-5
  • DOI10.1007/s11664-019-07576-x
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