Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity
- 期刊名称IEEE Transactions on Device and Materials Reliability
- 作者Tsai, M. Y.; Huang, P. S.; Yeh, J. H.; Liu, H. Y.; Chao, Y. C.; Tsai, Fila; Chen, D. L.; Shih, M. K.; Tarng, David
- 印刷ISSN1530-4388
- 电子ISSN1558-2574
- 文件大小2263.96KB
- 发表时间2019
- DOI10.1109/TDMR.2019.2937988
- 页码1-1
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