[IEEE 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - New Orleans, LA, USA (2019.7.22-2019.7.26)] 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - An Integer Programming Application for PCB Stack-up Arrangement
- 作者He, Jiayi; Klivans, Adam; Kiguradze, Zurab; Chada, Arun; Mutnury, Bhyrav; Reddy, Jay; Drewniak, James; Fan, Jun
- 文件大小313.77KB
- 发表时间2019
- DOI10.1109/isemc.2019.8825215
- 页码432-436
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