Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure
Wang, I-Ju; Ku, Ching-Shun; Lam, Tu-Ngoc; Huang, E-Wen; Tu, K. N.; Chen, Chih
- 期刊名称Journal of Electronic Materials
- 作者Wang, I-Ju; Ku, Ching-Shun; Lam, Tu-Ngoc; Huang, E-Wen; Tu, K. N.; Chen, Chih
- 印刷ISSN0361-5235
- 电子ISSN1543-186X
- 文件大小2650.68KB
- 发表时间2019-11-12
- DOI10.1007/s11664-019-07742-1