[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging
Bhogaraju, Sri Krishna; Mokhtari, Omid; Pascucci, Jacopo; Hanss, Alexander; Schmid, Maximilian; Conti, Fosca; Elger, Gordon
- 作者Bhogaraju, Sri Krishna; Mokhtari, Omid; Pascucci, Jacopo; Hanss, Alexander; Schmid, Maximilian; Conti, Fosca; Elger, Gordon
- 文件大小1682.04KB
- 发表时间2019
- DOI10.23919/EMPC44848.2019.8951887
- 页码1-8