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[IEEE 2019 3rd International Conference on Electrical, Telecommunication and Computer Engineering (ELTICOM) - Medan, Indonesia (2019.9.16-2019.9.17)] 2019 3rd International Conference on Electrical, Telecommunication and Computer Engineering (ELTICOM) - Directional Coupler Miniaturization Based on Multilayer Monolithic Microwave Integrated Circuit Technique

[IEEE 2019 3rd International Conference on Electrical, Telecommunication and Computer Engineering (ELTICOM) - Medan, Indonesia (2019.9.16-2019.9.17)] 2019 3rd International Conference on Electrical, Telecommunication and Computer Engineering (ELTICOM) - Directional Coupler Miniaturization Based on Multilayer Monolithic Microwave Integrated Circuit Technique

Zaini, Royza I.; Sinulingga, Emerson Pascawira; Handasah, Ummu
  • 作者Zaini, Royza I.; Sinulingga, Emerson Pascawira; Handasah, Ummu
  • 文件大小329.38KB
  • 发表时间2019
  • DOI10.1109/ELTICOM47379.2019.8943862
  • 页码165-167
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