[IEEE 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Sapporo, Japan (2019.6.3-2019.6.7)] 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Development and validation of a wide band Near Field Scan probe for the investigation of the radiated immunity of Printed Circuit Boards

• 作者Durier, Andre; Ben Dhia, Sonia; Dubois, Tristan
• 文件大小702.91KB
• 发表时间2019
• DOI10.23919/EMCTokyo.2019.8893811
• 页码649-652