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[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Fast Physical Verification for 16nm Package Electrical Performance

[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Fast Physical Verification for 16nm Package Electrical Performance

Shi, Hong; Lee, Chao-Chin; Chu, Chia-Hui; Chiou, Shian-Min; Chiu, Po-Wei; Leung, Dennis
  • 作者Shi, Hong; Lee, Chao-Chin; Chu, Chia-Hui; Chiou, Shian-Min; Chiu, Po-Wei; Leung, Dennis
  • 文件大小7788.65KB
  • 发表时间2019
  • DOI10.1109/EDAPS47854.2019.9011678
  • 页码1-3
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