[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Fabrication of Deep Microfeatures in Glass Substrate using Electrochemical Discharge Machining for Biomedical and Microfluidic Applications
- 作者Mishra, Dileep Kumar; Arab, Julfekar; Pawar, Karan; Dixit, Pradeep
- 文件大小10020.44KB
- 发表时间2019
- DOI10.1109/EPTC47984.2019.9026714
- 页码263-266
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