[IEEE 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Richland, WA, USA (2019.10.20-2019.10.23)] 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Effect of Micron Thermal Conductive Filler on Thermal Conductivity and Electrical Properties of Epoxy Composites
Tuo, Rui; Zhang, Yiran; Yang, Wei; He, Shaojian; Xie, Qing; Lin, Jun; Bian, Xingming
- 作者Tuo, Rui; Zhang, Yiran; Yang, Wei; He, Shaojian; Xie, Qing; Lin, Jun; Bian, Xingming
- 文件大小560.41KB
- 发表时间2019
- DOI10.1109/ceidp47102.2019.9009895
- 页码717-720