[IEEE 2020 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2020.2.16-2020.2.20)] 2020 IEEE International Solid- State Circuits Conference - (ISSCC) - 2.4 A 7nm High-Performance and Energy-Efficient Mobile Application Processor with Tri-Cluster CPUs and a Sparsity-Aware NPU
Duk Kim, Young; Jeong, Wookyeong; Jung, Lakkyung; Shin, Dongsuk; Song, Jae Geun; Song, Jinook; Kwon, Hyeokman; Lee, Jaeyoung; Jung, Jaesu; Kang, Myungjin; Jeong, Jaehun; Kwon, Yoonjoo; Seong, Nak Hee
- 作者Duk Kim, Young; Jeong, Wookyeong; Jung, Lakkyung; Shin, Dongsuk; Song, Jae Geun; Song, Jinook; Kwon, Hyeokman; Lee, Jaeyoung; Jung, Jaesu; Kang, Myungjin; Jeong, Jaehun; Kwon, Yoonjoo; Seong, Nak Hee
- 文件大小405.38KB
- 发表时间2020
- DOI10.1109/ISSCC19947.2020.9062907
- 页码48-50