胡征创作拾穗
- 作者胡征著
- 出版社银川：宁夏人民出版社
- 标注页数290 页
- 文件页数296 页
- 文件大小20.25 MB
- 出版时间1997
- ISBN7227017346
[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - ITherm 2018 Conference Schedule2018
[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - ITherm 2018 Keynotes2018
[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - ITherm 2018 TOC2018
[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - ITherm 2018 Conference Technical Program2018
[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - ITherm 2018 Conference Organization Committee2018
[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - [Front matter]2018
[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - ITherm 2018 Welcome Letter2018
[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - ITherm 2018 Copyright Page2018
Elastic Behavior of Coarse-Grained SnAgCu (SAC) Solder Joints Based on an Anisotropic Multi-scale Predictive Modeling ApproachJiang, Qian; Deshpande, Abhishek; Dasgupta, Abhijit · Journal of Electronic Materials · 2019
[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Fatigue Life of Joint-Scale SAC305 Solder Specimens in Tensile and Shear ModeDeshpande, Abhishek; Jiang, Qian; Dasgupta, Abhijit; Becker, Ulrich · 2019
[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?Jiang, Qian; Deshpande, Abhishek; Dasgupta, Abhijit · 2017