![Electroless Nickel Ternary Alloy Deposition on SiO[sub 2] for Application to Diffusion Barrier Layer in Copper Interconnect Technology]()
Electroless Nickel Ternary Alloy Deposition on SiO[sub 2] for Application to Diffusion Barrier Layer in Copper Interconnect TechnologyOsaka, Tetsuya; Takano, Nao; Kurokawa, Tetsuya; Kaneko, Tomomi; Ueno, Kazuyoshi · Journal of The Electrochemical Society · 2002