MEDICAL EDUCATION IN FORMER DAYS.
- 期刊名称The Lancet
- 作者Hawkins, Charles
- 卷第132卷
- 期第3395期
- 印刷ISSN0140-6736
- 文件大小461.78KB
- 发表时间1888-9
- DOI10.1016/S0140-6736(01)92581-4
- 页码595-596
[ECS 213th ECS Meeting - Phoenix, AZ (May 18 - May 23, 2008)] ECS Transactions - Impedance of Porous ElectrodesLasia, A. · 2008
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[ECS 213th ECS Meeting - Phoenix, AZ (May 18 - May 23, 2008)] ECS Transactions - Electrochemically Grown Metallic Inverse OpalsZhu, Rong; McLachlan, Martyn; McComb, David; Ryan, Mary · 2008
[ECS 213th ECS Meeting - Phoenix, AZ (May 18 - May 23, 2008)] ECS Transactions - Superconformal Film Growth: Mechanism and QuantificationMoffat, Thomas; Wheeler, Daniel; Josell, Daniel · 2008
[ECS 213th ECS Meeting - Phoenix, AZ (May 18 - May 23, 2008)] ECS Transactions - Failure Analysis of Electroplated Metallic ComponentsSuess, Steven J.; Brown, Craig C. · 2008
Room-Temperature Vapor Deposition of Cobalt Nitride Nanofilms for Mesoscopic and Perovskite Solar CellsKang, Jin Soo; Kim, Jae-Yup; Yoon, Jungjin; Kim, Jin; Yang, Jiwoong; Chung, Dong Young; Kim, Min-cheol; Jeong, Hansol; Son, Yoon Jun; Kim, Bong Gyu; Jeong, Juwon; Hyeon, Taeghwan; Choi, Mansoo; Ko, Min Jae; Sung, Yung-Eun · Advanced Energy Materials · 2018
Solar Cells: Room-Temperature Vapor Deposition of Cobalt Nitride Nanofilms for Mesoscopic and Perovskite Solar Cells (Adv. Energy Mater. 13/2018)Kang, Jin Soo; Kim, Jae-Yup; Yoon, Jungjin; Kim, Jin; Yang, Jiwoong; Chung, Dong Young; Kim, Min-cheol; Jeong, Hansol; Son, Yoon Jun; Kim, Bong Gyu; Jeong, Juwon; Hyeon, Taeghwan; Choi, Mansoo; Ko, Min Jae; Sung, Yung-Eun · Advanced Energy Materials · 2018
Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical PolishingKang, Min Cheol; Kim, Yung Jun; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong · Electrochemical and Solid-State Letters · 2009
In Situ Formation of Ag Capping Layer for Preventing Oxidation in Copper Chemical Mechanical PolishingKang, Min Cheol; Kim, Yung Jun; Kim, Jae Jeong · Electrochemical and Solid-State Letters · 2009
Gallic Acid as a Complexing Agent for Copper Chemical Mechanical Polishing Slurries at Neutral pHKim, Yung Jun; Kang, Min Cheol; Kwon, Oh Joong; Kim, Jae Jeong · Japanese Journal of Applied Physics · 2011
Development of a Copper Chemical Mechanical Polishing Slurry at Neutral pH Based on Ceria SlurryKim, Yung Jun; Kwon, Oh Joong; Kang, Min Cheol; Suh, Myung-Won; Im, Young; Kim, Jae Jeong · Journal of The Electrochemical Society · 2010
Effects of the Functional Groups of Complexing Agents and Cu Oxide Formation on Cu Dissolution Behaviors in Cu CMP ProcessKim, Yung Jun; Kwon, Oh Joong; Kang, Min Cheol; Kim, Jae Jeong · Journal of The Electrochemical Society · 2011