![[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Reliability evaluation of GaN based light-emitting diodes under high-temperature stressing]()
[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Reliability evaluation of GaN based light-emitting diodes under high-temperature stressingFu, Meijuan; Yin, Luqiao; Weng, Fei; Yang, Lianqiao; Zhang, Jianhua · 2012