![Reliability of Al Wire Bonding for SiC Power Modules Operating at Temperatures Above 200^|^deg;C]()
Reliability of Al Wire Bonding for SiC Power Modules Operating at Temperatures Above 200^|^deg;CTANISAWA, Hidekazu; TANISAWA, Hidekazu; TANIMOTO, Satoshi; TANIMOTO, Satoshi; WATANABE, Kinuyo; SATO, Shinji; SATO, Shinji; MATSUI, Kohei; MATSUI, Kohei; MURAKAMI, Yoshinori; MURAKAMI, Yoshinori; SASAKI, Kensuke; SASAKI, Kensuke · Journal of Smart Processing · 2013