Minimization of Residual Stress in SOI Films by Using AlN Interlaid Insulator
- 期刊名称Japanese Journal of Applied Physics
- 作者Ogura, Atsushi; Egami, Koji; Kimura, Masakazu
- 卷第24卷
- 印刷ISSN0021-4922
- 文件大小146.94KB
- 发表时间1985-8-20
- DOI10.1143/JJAP.24.L669
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