Why Triangulate?
- 期刊名称Educational Researcher
- 作者Sandra Mathison
- 卷第17卷
- 期第2期
- 印刷ISSN0013-189X
- 电子ISSN1935-102X
- 文件大小225.05KB
- 发表时间1988-03
- DOI10.2307/1174583
- 页码13-17
[IEEE 1994 IEEE International Symposium on Electrical Insulation - Pittsburgh, PA, USA (5-8 June 1994)] Proceedings of 1994 IEEE International Symposium on Electrical Insulation - Partial discharge recognition and localization on transformers via fuzzy logicWenzel, D.; Borsi, H.; Gockenbach, E. · 1994
[IEEE 2003 Electrical Insulation Conference/Electrical Manufacturing and Coil Winding Expo - Indianapolis, Indiana, USA (23-25 Sept. 2003)] Proceedings: Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Technology Conference (Cat. No.03CH37480) - Partial discharge weak spots localization in the stator insulation of running turbo generatorsvan Breen, H.J.; Gulski, E.; Smit, J.J. · 2003
[IEEE 2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2012) - Montreal, QC, Canada (2012.10.14-2012.10.17)] 2012 Annual Report Conference on Electrical Insulation and Dielectric Phenomena - Partial discharge detection and localization inside the winding of power transformerRotby, Sally N.; El-Hag, Ayman H.; Salama, M. M. A.; Bartnikas, R. · 2012
[IEEE 2018 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Cancun, Mexico (2018.10.21-2018.10.24)] 2018 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Optimized Arrival Time Determination of UHF Pulses for Localization of Partial Discharges in Power TransformersAzirani, M. Akbari; Ariannik, M.; Werle, P.; Akbari, A. · 2018
[IEEE 2018 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Cancun, Mexico (2018.10.21-2018.10.24)] 2018 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Feasibility of Partial Discharge Localization in Power Transformers based on a novel Curve Fitting MethodRahimbakhsh, M.; Mostoofi, M.; Werle, P.; Gockenbach, E. · 2018
[IEEE 2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Quebec City, QC, Canada (2008.10.26-2008.10.29)] 2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena - Identification and Localization of Multi-source Partial Discharges by Acoustic Measurements in Oil-pressboard Insulation SystemKundu, Prasanta; Kishore, N.K.; Sinha, A.K. · 2008
[IEEE 2016 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Toronto, ON, Canada (2016.10.16-2016.10.19)] 2016 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Determination of transfer function of power transformer winding sections for partial discharge localization using design informationRahimbakhsh, M.; Werle, P.; Gockenbach, E. · 2016
[IEEE 2018 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Cancun (2018.10.21-2018.10.24)] 2018 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Quantitative Comparison of Partial Discharge Localization algorirthms on Power Transformers Based on Acoustic MethodWang, Yan-Bo; Zhang, Guan-Jun; Qin, Shao-Rui; Wang, Liu-Fang; Ding, Guo-Cheng; Li, Jian-Lin; Zhu, Tai-Yun · 2018
[IEEE 2001 IEEE Industry Applications Society 36th Annual Meeting - IAS'01 - Chicago, IL, USA (30 Sept.-4 Oct. 2001)] Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248) - IGBT module technology with high partial discharge resistanceMitic, G.; Licht, T.; Lefranc, G. · 2001
[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Thermo-mechanical properties and creep deformation of lead-containing and lead-free soldersSchubert, A.; Walter, H.; Dudek, R.; Michel, B.; Lefranc, G.; Otto, J.; Mitic, G. · 2001
[IEEE Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting - St. Louis, MO, USA (12-15 Oct. 1998)] Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242) - The thermal impedance of new power semiconductor modules using AlN substratesMitic, G.; Sommer, K.-H.; Dieci, D.; Lefranc, G. · 1998