SPIE Proceedings [SPIE Boston - DL tentative - Boston, MA (Tuesday 25 September 1990)] Microelectronic Interconnects and Packages: System and Process Integration - Challenges of using advanced multichip packaging for next generation spaceborne computers
- 作者Moravec, Thomas J.; Tewksbury, Stuart K.; Carruthers, John R.
- 卷第1390卷
- 印刷ISSN0277-786X
- 文件大小382.47KB
- 发表时间1991
- DOI10.1117/12.25576
- 页码195-201
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