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- 期刊名称Computers in the Schools
- 作者Vidoni, Kimberly L.; Maddux, Cleborne D.
- 卷第19卷
- 印刷ISSN0738-0569
- 电子ISSN1528-7033
- 文件大小597.91KB
- 发表时间2002-08-27
- DOI10.1300/J025v19n01_09
- 页码101-117
Electroexcitation of the first excited state in 39KC.W. De Jager; P.H.M. Keizer; E.A.J.M. Offermann; H. De Vries; M.V. Hynes; S. Kowalski; C.N. Rad; C.F. Williamson · 1985
A high power liquid 3,4He target system for electron scattering experimentsH. Postma; J.P. Boogaard; P.H.M. Keizer; L. Prins; P.K.A. De Witt Huberts · 1984
Two-body electrodisintegration of 3He at large recoil momentumP.H.M. Keizer; J.F.J. van den Brand; J.W.A. den Herder; E. Jans; L. Lapikás; E.N.M. Quint; P.K.A. de Witt Huberts; H. Postma · 1987
Deuteron knockout from 3He with the (e,e'd) reactionP.H.M. Keizer; P.C. Dunn; J.W.A. Den Herder; E. Jans; A. Kaarsgaarn; L. Lapikás; E.N.M. Quint; P.K.A. De Witt Huberts; H. Postma; J.M. Laget · 1985
Knock-out of 2p protons from the interior of 90ZrJ.W.A. Den Herder; E. Jans; P.H.M. Keizer; L. Lapikás; E.N.M. Quint; P.K.A. De Witt Huberts; H.P. Blok; G. Van Der Steenhoven · 1987
Single-particle properties of 51V and 90Zr studied with the (e,e'p) reactionJ.W.A. den Herder; H.P. Blok; E. Jans; P.H.M. Keizer; L. Lapikás; E.N.M. Quint; G. van der Steenhoven; P.K.A. de Witt Huberts · 1988
Fragmentation of the 1f-hole strength in 90Zr studied with the (e,e′p) reactionJ.W.A. Den Herder; P.C. Dunn; E. Jans; P.H.M. Keizer; L. Lapiḱas; E.N.M. Quint; P.K.A. De Witt Huberts; H.P. Blok; G. Van Der Steenhoven · 1985
Development of modular productsKusiak, A.; Chun-Che Huang, · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1996
Dynamic manufacturing process controlPearsall, K.; Raines, B. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1994
Electronic Components ObsolescenceCondra, L.W.; Anissipour, A.A.; Mayfield, D.D.; Pecht, M.G. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1997
Nonvolatile MemoryBrewer, J.E. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1997
Semiconductor workbench for integrated modelingWeckman, J. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1994
The benefits of stress testingChan, H.A. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1995
[Back cover]IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1998
Call for papersIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1998