Ceramic multicomponent modules: a new approach to miniaturization : Paul H. M. Keizer. IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part A, 17, 3, 334 (September 1994)
- 卷第36卷
- 期第3期
- 印刷ISSN0026-2714
- 文件大小113.82KB
- 发表时间1996
- DOI10.1016/0026-2714(96)81983-4
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