[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Surface-based PEEC formulation for modeling conductors and dielectrics in time and frequency domain combined circuit electromagnetic simulations
- 作者Gope, D.; Ruehli, A.; Jandhyala, V.
- 文件大小261.29KB
- 发表时间2004
- DOI10.1109/EPEP.2004.1407625
- 页码329-332
(S)PEEC: Time- and frequency-domain surface formulation for modeling conductors and dielectrics in combined circuit electromagnetic simulationsGope, D.; Ruehli, A.E.; Chuanyi Yang, ; Jandhyala, V. · 2006
[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Surface-based PEEC formulation for modeling conductors and dielectrics in time and frequency domain combined circuit electromagnetic simulationsGope, D.; Ruehli, A.; Jandhyala, V. · 2004
[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Solving low frequency EM-CKT problems using the PEEC methodGope, D.; Ruehli, A.; Jandhyala, V. · 2005