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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging Volume 44 || Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging Volume 44 || Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results

Suhir, E.; Lee, Y. C.; Wong, C. P.

作者Suhir, E.; Lee, Y. C.; Wong, C. P.
文件大小152.43KB
发表时间2007
DOI10.1007/0-387-32989-7_21

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