[IEEE 6th International Conference on Solid-State and IC Technology - Shanghai, China (22-25 Oct. 2001)] 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) - Investigation of substrate damage and other issues in hydrogen plasma implantation for silicon-on-insulator (SOI) fabricationFu, R.K.Y.; Wang, L.W.; Chu, P.K. · 2001

Electro-rheologyBlock, H; Kelly, J P · Journal of Physics D: Applied Physics · 1988

Semiconductor nanowiresLu, Wei; Lieber, Charles M · Journal of Physics D: Applied Physics · 2006

Nanoassembled model catalystsHeiz, Ueli; Schneider, Wolf-Dieter · Journal of Physics D: Applied Physics · 2000

Mechanisms for exchange biasStamps, R L · Journal of Physics D: Applied Physics · 2000

Thermal plasma waste treatmentHeberlein, Joachim; Murphy, Anthony B · Journal of Physics D: Applied Physics · 2008

Surface enhanced fluorescenceFort, Emmanuel; Grésillon, Samuel · Journal of Physics D: Applied Physics · 2008

Nanocomposite dielectrics—properties and implicationsNelson, J K; Hu, Y · Journal of Physics D: Applied Physics · 2005

Memristor-based neural networksThomas, Andy · Journal of Physics D: Applied Physics · 2013