supersymmetric Higgs model
- 期刊名称Physical Review D
- 作者Bertolini, Stefano; Di Luzio, Luca; Malinský, Michal
- 卷第83卷
- 期第3期
- 印刷ISSN1550-7998
- 电子ISSN1550-2368
- 文件大小450.27KB
- 发表时间2011-2-2
- DOI10.1103/PhysRevD.83.035002
MEMS Reliability ReviewHuang, Yunhan; Sai Sarathi Vasan, Arvind; Doraiswami, Ravi; Osterman, Michael; Pecht, Michael · IEEE Transactions on Device and Materials Reliability · 2012
Design for soft error mitigationNicolaidis, M. · IEEE Transactions on Device and Materials Reliability · 2005
ErratumBrennan, Claire; Draksharapu, Apparao; Browne, Wesley R.; McGarvey, John J.; Vos, Johannes G.; Pryce, Mary T. · IEEE Transactions on Device and Materials Reliability · 2005
Fuse Regrowth KineticsLambert, D.; Gannamani, R.; Blish, R.C. · IEEE Transactions on Device and Materials Reliability · 2004
Author's replyMiranda, E. · IEEE Transactions on Device and Materials Reliability · 2006
Timing Vulnerability Factors of SequentialsSeifert, N.; Tam, N. · IEEE Transactions on Device and Materials Reliability · 2004
Popcorn Cavity PressureShirley, C. Glenn · IEEE Transactions on Device and Materials Reliability · 2014
Device ArchitectureTao, Guoqiao; Chauveau, Helene; Nath, Som; Dormans, Do; Verhaar, Rob · IEEE Transactions on Device and Materials Reliability · 2007