[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Thermal resistance investigations on new leadframe-based LED packages and boardsPardo, B.; Gasse, A.; Fargeix, A.; Jakovenko, J.; Werkhoven, R.J.; Perpina, X.; Van Weelden, T.; Bancken, P. · 2012

Thermal heating within SOIKoning, J.J.; Lecaudey, S.; Spaan, E.; Stoutjesdijk, M.; Janssen, J.H.J. · Microelectronics Reliability · 2008

Inside front cover - Editorial boardMicroelectronics Reliability · 2008

RF CMOS reliability simulationsSasse, Guido T.; Acar, Mustafa; Kuper, Fred G.; Schmitz, Jurriaan · Microelectronics Reliability · 2008

EditorialGroeseneken, Guido; Wolf, Ingrid De; Mouthaan, Anton; Bisschop, Jaap · Microelectronics Reliability · 2008

Inside front cover - Editorial boardMicroelectronics Reliability · 2014

Book ReviewNaikan, Vallayil N.A. · Microelectronics Reliability · 2013

Endurance behavior of conductive yarnsde Vries, Hans; Cherenack, Kunigunde H. · Microelectronics Reliability · 2014

Trends in automotive power semiconductor packagingDietrich, Peter · Microelectronics Reliability · 2013