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Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu soldersMoser, Z.; Fima, P.; Bukat, K.; Sitek, J.; Pstruś, J.; Gąsior, W.; Kościelski, M.; Gancarz, T. · Soldering & Surface Mount Technology · 2011
Experimental Investigation on the Effect of Ag Addition on Ternary Lead Free Solder Alloy –Sn–0.5Cu–3BiJayesh, S.; Elias, Jacob · Metals and Materials International · 2019
A FORC investigation into the effect of Cu additive on magnetic characteristics of Co-Ni alloy nanoparticlesOroujizad, Sahar; Almasi-Kashi, Mohammad; Alikhanzadeh-Arani, Sima · Journal of Magnetism and Magnetic Materials · 2018
X-Ray Microtomography Investigation of the Effect of Ba Additions on the Microstructure of Partially Remelted Al-4%Cu AlloysTerzi, Sofiane; Limodin, Nathalie; Boller, Elodie; Salvo, Luc; Suéry, Michel · Solid State Phenomena · 2008
Theoretical Investigation on the Mechanism of Cu(II)-catalyzed Synthesis of 4-Quinolones: Effects of Additives HOTf vs. HOTsYuan, Binfang; Guo, Xiaogang; Wang, Guangzhao; Huang, Huisheng; Zhang, Fulan; Xu, Jianhua; He, Rongxing · New Journal of Chemistry · 2019
Investigation of the Effect of Manufacturing Methods and Sr Addition on the Structure and Properties of Solder 34А (Al – 27% Cu – 6% Si)Tavolzhanskii, S. A.; Bazhenov, V. E.; Pashkov, I. N. · Metallurgist · 2020