[IEEE 2012 19th IEEE International Conference on Electronics, Circuits and Systems - (ICECS 2012) - Seville, Seville, Spain (2012.12.9-2012.12.12)] 2012 19th IEEE International Conference on Electronics, Circuits, and Systems (ICECS 2012) - Analysis of coupling capacitance between TSVs and metal interconnects in 3D-ICs
- 作者Salah, Khaled
- 文件大小403.38KB
- 发表时间2012
- DOI10.1109/ICECS.2012.6463647
- 页码745-748
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