海量图书期刊资源,随时随地畅享阅读乐趣
Development of modular productsKusiak, A.; Chun-Che Huang, · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1996
Dynamic manufacturing process controlPearsall, K.; Raines, B. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1994
Electronic Components ObsolescenceCondra, L.W.; Anissipour, A.A.; Mayfield, D.D.; Pecht, M.G. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1997
Nonvolatile MemoryBrewer, J.E. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1997
Semiconductor workbench for integrated modelingWeckman, J. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1994
The benefits of stress testingChan, H.A. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1995
Metal diffusion in polymersDas, J.H.; Morris, J.E. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1994
Multiconductor transmission line characterizationWilliams, D.F. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1997