Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED Modules
Juntunen, Eveliina; Sitomaniemi, Aila; Tapaninen, Olli; Persons, Ryan; Challingsworth, Mark; Heikkinen, Veli
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Juntunen, Eveliina; Sitomaniemi, Aila; Tapaninen, Olli; Persons, Ryan; Challingsworth, Mark; Heikkinen, Veli
- 卷第2卷
- 期第12期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小1038.88KB
- 发表时间2012-12
- DOI10.1109/tcpmt.2012.2206390
- 页码1957-1964