![[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - A chip stacking technology utilizing transmission line coupling]()
[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - A chip stacking technology utilizing transmission line couplingDaisuke Iguchi, ; Yutaka Akiyama, ; Tsuneo Ito, ; Kanji Otsuka, · 2008