[IEEE 2013 IEEE International Symposium on Intelligent Signal Processing (WISP) - Funchal, Portugal (2013.09.16-2013.09.18)] 2013 IEEE 8th International Symposium on Intelligent Signal Processing - Table of contents
- 文件大小58.72KB
- 发表时间2013
- DOI10.1109/wisp.2013.6657471
Development of Advanced All-SiC Power ModulesLiang, Zhenxian; Ning, Puqi; Wang, Fred · IEEE Transactions on Power Electronics · 2014
Advances in postharvest sulfur handling technology on longan fruitLiang, Shuai; Dongmei, Han; Zhenxian, Wu · Acta Horticulturae · 2018
Deep level defects in si-implanted lec undoped Si−GaAsLiang Zhenxian; Luo Jinsheng · 1991
Embedded power: a 3-D MCM integration technology for IPEM packaging applicationZhenxian Liang; van Wyk, J.D.; Lee, F.C. · 2006
Hepatitis E Virus Genotype 4, Nanjing, China, 2001–2011Dai, Xing; Dong, Chen; Zhou, Zhenxian; Liang, Jiuhong; Dong, Min; Yang, Yan; Fu, Jianguang; Tian, Hua; Wang, Song; Fan, Jie; Meng, Jihong; Purdy, Michael A. · Emerging Infectious Diseases · 2013
High Temperature Embedded SiC Chip Module (ECM) for Power Electronics ApplicationsYin, Jian; Liang, Zhenxian; van Wyk, Jacobus Daniel · IEEE Transactions on Power Electronics · 2007
Investigation of Si IGBT Operation at 200<formula formulatype="inline"><tex notation="TeX">$,{}^circ$</tex></formula>C for Traction ApplicationsXu, Zhuxian; Li, Ming; Wang, Fei; Liang, Zhenxian · IEEE Transactions on Power Electronics · 2013
Power Module and Cooling System Thermal Performance Evaluation for HEV ApplicationPuqi Ning, ; Zhenxian Liang, ; Wang, Fred · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2014