[IEEE 2014 International 3D Systems Integration Conference (3DIC) - Kinsdale, Ireland (2014.12.1-2014.12.3)] 2014 International 3D Systems Integration Conference (3DIC) - Novel methodology for 3D MEMS-IC design and co-simulation on MEMS microphone smart system example

• 作者Bieniek, T.; Janczyk, G.; Ekwinska, M.; Budzynski, T.; Gluszko, G.; Grabiec, P.; Kociubinski, A.
• 文件大小2075.06KB
• 发表时间2014
• DOI10.1109/3dic.2014.7152184
• 页码1-5