![Relationship between the thermal stress and structures of thermal-cycling-induced cracks in electroless nickel plating on metalized substrates]()
Relationship between the thermal stress and structures of thermal-cycling-induced cracks in electroless nickel plating on metalized substratesFukuda, Shinji; Shimada, Kazuhiko; Izu, Noriya; Miyazaki, Hiroyuki; Iwakiri, Shoji; Hirao, Kiyoshi · Journal of Materials Science: Materials in Electronics · 2019