[IEEE 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) - Wien, Vienna, Austria (2016.1.25-2016.1.27)] 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) - Modeling heat dissipation in an SOI device finite element analysis at semiconductor die level

• 作者Hosey, George P.
• 文件大小514.73KB
• 发表时间2016
• DOI10.1109/ULIS.2016.7440089
• 页码206-209