[IEEE 2016 11th International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM) - Smolenice, Slovakia (2016.11.13-2016.11.16)] 2016 11th International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM) - 3-D device and circuit electrothermal simulations of power integrated circuit including package
- 作者Chvala, Ales; Benko, Peter; Pribytny, Patrik; Marek, Juraj; Donoval, Daniel
- 文件大小514.50KB
- 发表时间2016
- DOI10.1109/ASDAM.2016.7805921
- 页码165-168
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