ASEMD 2015—Introduction
- 期刊名称IEEE Transactions on Applied Superconductivity
- 作者Coombs, T. A.; Du, B. X.; Guo, Y. G.; He, Y. S.; Lee, H. J.; Xiao, X. Y.; Du, J.; Jin, J. X.; Wang, X. L.; Zhu, J. G.; Wang, X. L.
- 卷第26卷
- 期第7期
- 印刷ISSN1051-8223
- 电子ISSN1558-2515
- 文件大小64.77KB
- 发表时间2016-10
- DOI10.1109/tasc.2016.2605184
- 页码1-1
[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Compact electro-thermal model of semiconductor device with nonlinear convection coefficientFeng, L.H.; Rudnyi, E.B.; Korvink, J.G.; Bohm, C.; Hauck, T. · 2005
[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Coupled electro-mechanics simulation methodology of the dynamic pull-in in micro-systemsRochus, V.; Rixen, D.J.; Golinval, J.-C. · 2005