海量图书期刊资源,随时随地畅享阅读乐趣
Thermal Stress Cleaving of Si-Wafer: Investigation of Fracture Initiation during Laser Beam IrradiationSaman, Alias Mohd; Furumoto, Tatsuaki; Hosokawa, Akira; Ueda, Takashi · Advanced Materials Research · 2015
A study on separating of a silicon wafer with moving laser beam by using thermal stress cleaving techniqueSaman, Alias Mohd; Furumoto, Tatsuaki; Ueda, Takashi; Hosokawa, Akira · Journal of Materials Processing Technology · 2015
3D medical image segmentation techniquesaid, Shaimaa Ahmed El · International Journal of Biomedical Engineering and Technology · 2015
Ancient Egyptian Tool TechnologyHelps, F G · The International Journal for the History of Engineering & Technology · 2011
Wavelets: biomedical applicationsSingh, Satya P.; Urooj, Shabana · International Journal of Biomedical Engineering and Technology · 2015
EditorialThe International Journal for the History of Engineering & Technology · 2015
ReviewsThe International Journal for the History of Engineering & Technology · 2012
ReviewsThe International Journal for the History of Engineering & Technology · 2011
EditorialCline, Roger · International Journal for the History of Engineering & Technology · 2009
ErratumThe International Journal for the History of Engineering & Technology · 2013