![Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn–Ag–Cu solder bumps]()
Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn–Ag–Cu solder bumpsSon, Min-Jung; Jeong, Jae Won; Kim, Hyunchang; Lee, Taik-Min; Lee, Hoo-Jeong; Kim, Inyoung · Journal of Materials Science: Materials in Electronics · 2018