![[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Micro Embossing of LTCC (Low Temperature Co-fired Ceramic) Green Substrates]()
[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Micro Embossing of LTCC (Low Temperature Co-fired Ceramic) Green SubstratesMaw, Hla Phone; Wai, Shi Chee; Tjeung, Ricky T.; Lu Chee Wai, ; Keng, Lok Boon; Xuechuan, Shan · 2007